Product details
Product category / NTC Bare Chip
Gold Electrode NTC Thermistor Chip (Bare Chip)
DT-G series gold electrode NTC thermistor chip (bare chip) is leadless, its miniature encapsulation is designed for hybrid applications where bonding wire or Au/Sn solder is used as the connection method.
Product Features
Product Characteristics
Product Application
Product Features
- High accuracy, can reach ±0.3%, ±0.5%, ±1%, etc.
- Fast response
- Excellent reliability
- Great consistency
Product Characteristics
- Operating temperature range: -40~300℃
- Miniature size
Product Application
- Bonding (infrared thermoelectric reactor, IGBT, thermal printing head, Integrate module, semiconductor module, power mould, etc).
- Smart Wear
- Optical Transceiver
| DT | 103 | F | 3950 | A | -G | -B | -M | |||
| Product Code | Resistance Value R25℃ | Tolerance | Beta | Test Temperature of Beta | Electrode Materials | Welding Mode | Packing Method | |||
| DT-G Series NTC Thermistor Chip (Bare Chip) | 202 | 20×102Ω | D | ±0.5% | 3435 | A | 25℃/50℃ | G: Gold Electrode | B: Bonding | M: Blue Taping |
| 103 | 10×103Ω | F | ±1% | B | 25℃/85℃ | |||||
| 203 | 20×103Ω | G | ±2% | C | 0℃/25℃ | C: Common (Bonding & Solding) | T: Taping | |||
| 104 | 10×104Ω | H | ±3% | 4100 | D | 0℃/50℃ | A: Silver Electrode | |||
| 473 | 47×103Ω | J | ±5% | E | 0℃/100℃ | S: Solding | B: Bulk | |||
| *Special Parameters could be customized | ||||||||||
